Cairnhill Metrology

Traditional CT scanners often struggle with dense materials; the higher the density, the more challenging it is to achieve clear, detailed images. The Phoenix V|tome|x M, designed for 3D metrology and analysis, provides industry-leading magnification at 300kV, redefining the possibilities of industrial computed tomography (CT) scanning. This system penetrates deeper and reveals more than ever before.

V|tome|x M at Cairnhill Metrology Applications Centre scanning a mobile phone as the sample case.

The high-speed real-time data acquisition from various NDT sensors including the X-ray Dynamic 41|200 detector provides 10x increased sensitivity relative to the state-of-the-art 200µm pixel-size DXR detectors producing a 2-3x cycle time increase without image quality impact.

During scanning, the histogram displays the grey-scale values, enabling users to assess image quality and signal-to-noise ratio. This visual representation guides the users in making optimal adjustments to input parameters.

The imaging was performed at 250kV/50W using the microfocus X-ray tube with a current of 200μA. This configuration optimised both deep penetration and image clarity.

Parameters:

Voltage: As voltage is increased, the X-ray tube generates X-rays with higher energy levels. These high-energy X-rays are more penetrating and can travel through denser materials more easily.
Current: Increasing the current in the X-ray tube increases the number of electrons flowing through the tube, which in turn generates a more intense X-ray beam. This results in a brighter image with a higher signal strength.
Exposure Time: A longer exposure time means the X-ray beam is illuminating the sample for a longer duration, leading to a brighter image as more X-rays reach the detector, resulting in a stronger signal but also a higher radiation dose.

The Waygate Phoenix V|tome|x M is equipped with a maximum 300kV/500W microfocus X-ray tube—optionally combined with a high power 180kV / 20W nanofocus X-ray tube for the highest precision. With detail detectability down to less than 1 μm (microfocus tube); optional down to 0.2 μm (nanofocus tube).

Once the scan is completed, the Dato|s Reconstruction software can optimise the scan data images and reconstruct them into a 3D model. The Automatic Geometric Calibration (AGC) module compensates for the off-centre position of the sample on the x-axis. The Scan|optimizer compensates for small and smooth drift of axis position (sample, detector) or focus position (x-ray tube). The BHC+ (beam hardening correction) filter improves the image quality caused by the phenomenon of beam hardening where lower energy photons are absorbed by higher energy photons when an X-ray beam passes an object, leading to artefacts and inaccuracies in the reconstructed CT image.

Distinct colouring option Color-coded density variations clearly highlight regions of interest, simplifying analysis.

The V|tome|x M's 300kV penetration power delivers incredibly detailed 3D models of the entire phone in just 20 minutes. These high-resolution scans, easily imported into the Volume Graphics software: VGStudio Max, enable thorough analysis and evaluation of every component. Volume Graphics software also provides a suite of defect analysis which includes: Porosity Analysis, Wall Thickness Analysis, Nominal/Actual Comparison, and Advanced Measurement Tools.

2D cross-section offers a clear view 2D cross-sections offer a clear view of an object's internal structure, enabling users to identify defects, measure features, analyze material properties, and understand its geometry—all crucial for assessing quality, integrity, and suitability.

Visualizing Internal Structure: This allows the user to examine the internal structure of the object in detail, revealing features that might be hidden in the overall 3D model. This is crucial for identifying defects, assessing material properties, and understanding the object's internal geometry.
Identifying Defects: 2D cross-sections make it easier to spot defects that might be difficult to identify in the 3D model alone. For example, a crack might appear as a thin line in a 3D view, but it will be visible as a gap in a cross-section.
Precise Measurement: They allow for accurate measurements of features and defects. By analyzing the cross-section, you can determine the size, shape, and location of defects with greater precision.
Analyzing Material Properties: Cross-sections can reveal variations in material density, which can indicate inconsistencies in the material or the presence of inclusions. This information is critical for assessing the overall quality and integrity of the object.
Understanding Object Geometry: Cross-sections help users understand the object's internal geometry, such as the shape of cavities, the thickness of walls, and the arrangement of internal components. This information is valuable for design analysis, reverse engineering, and manufacturing processes.
Targeted Inspection: Users can use 2D cross-sections to focus on specific areas of interest within the 3D model. This allows you to conduct targeted inspections and analyze specific regions with greater detail.