One of the most recognized forms of analysis using X-ray CT is non-destructive testing/analysis. The ability to see what is inside a component after assembled is critical to understand how parts fit in their functioning position. The process to disassemble a part usually destroys some of the critical info and render the part unsuitable for further testing. X-ray CT non-destructive method comes into the picture for this kind of applications.
For electronics, CT scan data can also be used to check the track work of PCBs, wire crimps, BGA analysis, connectors connection, wire placements and more.
Two layers of PCB track work within a USB drive can be differentiated clearly from a CT scan and can be used to check for abnomalies.